W3110 Introduction

W3110 is a water-based cleaning agent developed for electronic assembly, post soldering cleaning of semiconductor devices, and pre wafer packaging cleaning. This product can effectively remove various flux and solder paste residues after soldering, including cleaning various flux and solder paste residues on circuit board assemblies, lead frames, discrete devices, power modules, power LEDs, flip chip and CMOS. W3110 combined with spray and ultrasonic cleaning processes, can achieve excellent cleaning results.

Enquire now

Sample test

W3110 Product Features

? When processing sensitive materials such as copper, aluminum, and especially nickel, it ensures excellent material compatibility and does not damage the protective layer of the chip.
? Capable of effectively removing residues in small gaps at the bottom of components and maintaining bright solder joints after cleaning.
? This product is easy to rinse with deionized water, and there is no residue or whitening on the cleaned parts and cleaning equipment.
? The diluent has no flash point, and its formula does not contain any halogen components and has a light odor.
? Dilute with deionized water in a certain proportion to prevent foaming, making it suitable for ultrasonic and spray processes.
? The concentrated solution can be diluted in different proportions according to the difficulty of cleaning the residue before use.

W3500

W3110 Applicable process

Mainly used for ultrasonic and spray cleaning processes.

Apply for product information

W3110 Application

W3110 is a water-based cleaning agent developed for soldering flux and solder paste residue in electronic assembly and semiconductor electronic devices.

The process flow is: adding liquid → loading → ultrasonic/spray cleaning → ultrasonic/spray rinsing → drying → unloading.